Application of semiconductor IC fabrication techniques to the ma

Abrading – Abrading process

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

451285, 451287, B24B 100

Patent

active

055955274

ABSTRACT:
A pad conditioning method and apparatus for chemical-mechanical polishing. A polishing pad (114) is attached to a platen (112) and used to polish a wafer (116). Rotating arm (118) positions the wafer (116) over the pad (114) and applies pressure. During wafer polishing particles build up on the polishing pad (114) reducing its effectiveness. Either during or in between wafer polishing (or both), conditioning head (122) is applied to pad (114) to remove the particles from pad (114) into the slurry (120). Conditioning head (122) comprises a semiconductor substrate (126) that is patterned and etched to fore a plurality of geometries (128) having a feature size on the order of polishing pad (114) cell size.

REFERENCES:
patent: 4172005 (1979-10-01), Muraoka et al.
patent: 4840701 (1989-06-01), Stern
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5216843 (1993-06-01), Breivoget et al.
patent: 5236549 (1993-08-01), Shirakawa et al.
patent: 5297364 (1994-03-01), Tuttle
patent: 5332467 (1994-07-01), Sune et al.
patent: 5342801 (1994-08-01), Perry et al.
patent: 5394012 (1995-02-01), Kimura
patent: 5413953 (1995-05-01), Chien et al.
patent: 5419804 (1995-05-01), Ojha et al.
patent: 5427976 (1995-06-01), Koh et al.
patent: 5441600 (1995-08-01), Smits

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Application of semiconductor IC fabrication techniques to the ma does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Application of semiconductor IC fabrication techniques to the ma, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Application of semiconductor IC fabrication techniques to the ma will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2321002

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.