Application of polymeric materials to substrates

Details Application of polymeric materials to substrates Application of polymeric materials to substrates

1985-12-11

1987-11-10

Czaja, Donald E.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156231, 156238, 156311, 4283044, B32B 518, B32B 324, B44C 116, C09J 500

Patent

active

047055847

ABSTRACT:
The invention relates to a method of applying polymeric materials to the surface of a substrate by providing a layer of polymeric material on a release sheet and then subsequently transferring the polymeric material from the release sheet by the application of heat and pressure sufficient to effect adhesion of the polymeric material to the substrate and thereafter peeling the release sheet from the polymeric material. The invention is particularly concerned with the application of polymeric materials being capable of a secondary reaction at the time of application to the substrate or subsequent thereto.

REFERENCES:
patent: 2559649 (1951-07-01), Little et al.
patent: 3523846 (1970-08-01), Muller
patent: 4171398 (1979-10-01), Huat
patent: 4275104 (1981-06-01), deNagybaczon
patent: 4294641 (1981-10-01), Reed et al.
patent: 4337289 (1982-06-01), Reed et al.
patent: 4374691 (1983-02-01), Yan den Bergh
patent: 4405393 (1983-09-01), Tillotson

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