Application and removal of thermal interface material

Details Application and removal of thermal interface material Application and removal of thermal interface material

2006-11-14

2008-05-06

Jones, Melvin (Department: 3744)

Refrigeration

Using electrical or magnetic effect

Thermoelectric; e.g., peltier effect

C062S003700

Reexamination Certificate

active

07367195

ABSTRACT:
A method, system and apparatus are described. The apparatus includes a first device to adjust a polarity associated with a thermoelectric (TEC) module. The adjustment is to control the flow of heat. The flow of heat is directed toward a thermal interface material (TIM) in order to melt the TIM up to an acceptable melt level. The apparatus further includes a second device to determine whether the TIM has melted up to the acceptable melt level. The apparatus includes an application device to apply the TIM to a heat sink if the TIM is melted has melted up to the acceptable melt level.

REFERENCES:
patent: 4389557 (1983-06-01), Devenyi et al.
patent: 4685081 (1987-08-01), Richman
patent: 4848090 (1989-07-01), Peters
patent: 5457342 (1995-10-01), Herbst, II
patent: 5655375 (1997-08-01), Ju
patent: 5712448 (1998-01-01), Vandersande et al.
patent: 6094919 (2000-08-01), Bhatia
patent: 6412287 (2002-07-01), Hughes et al.
patent: 6424533 (2002-07-01), Chu et al.
patent: 6798659 (2004-09-01), Chen
patent: 6845622 (2005-01-01), Sauciuc et al.
patent: 2004/0118129 (2004-06-01), Chrysler et al.

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