Appliance for attaching heat sink to pin grid array and socket

Details Appliance for attaching heat sink to pin grid array and socket Appliance for attaching heat sink to pin grid array and socket

1993-05-24

1995-03-07

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257718, 257719, 361710, H05K 720

Patent

active

053964020

ABSTRACT:
A device for attaching a heat sink to a chip having an integrated circuit and a pin grid array socket. The device includes a leaf spring pre-assembled to two plastic clips, each of the plastic clips containing a portion which is adapted to extend below the socket, thereby releasably securing the heat sink to the chip and the socket.

REFERENCES:
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patent: D317907 (1991-07-01), McCarthy
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patent: 4712159 (1987-12-01), Clemens
patent: 4933746 (1990-06-01), King
patent: 5040096 (1991-08-01), Churchill et al.
patent: 5208731 (1993-05-01), Blomquist
IBM Tech Disc. Bulletin, "Low Profile Heat Sink", vol. 28, No. 12, Jul. 1986, pp. 5172-5173.
IBM Technical Disclosure Bulletin, vol. 23, No. 12, May 1981, p. 5303.

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