Apparatuses for dissipating heat from semiconductor devices

Details Apparatuses for dissipating heat from semiconductor devices Apparatuses for dissipating heat from semiconductor devices

2008-05-06

2008-05-06

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S700000, C361S703000, C165S080400, C165S104210, C165S104260, C165S104330, C257S714000, C257S715000

Reexamination Certificate

active

07369410

ABSTRACT:
An apparatus for providing two-phase heat transfer for semiconductor devices includes a vapor chamber configured to carry a cooling liquid, the vapor chamber having base section, and a plurality of three-dimensional (3D) shaped members. The plurality of 3D-shaped members have interior and exterior sidewalls, the 3D-shaped members being connected to the base section so that vapor carrying latent heat can reach the respective interior sidewalls and get transferred to the respective exterior sidewalls configured to be in contact with an external coolant. The vapor chamber is configured to be in contact with a semiconductor device in order to remove heat therefrom.

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