Apparatuses for controlling the temperature of polishing...

Abrading – Precision device or process - or with condition responsive... – By optical sensor

Reexamination Certificate

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C451S056000, C451S285000, C451S443000, C051S302000

Reexamination Certificate

active

10198881

ABSTRACT:
Temperature regulation systems and methods for controlling the temperature of polishing pads used in planarizing micro-device workpieces are disclosed herein. In one embodiment, an apparatus for polishing a workpiece includes a platen defining a planarizing zone and a primary duct system. The platen can have a first duct, and the primary duct system can have a second duct operatively coupled to the first duct of the platen. The second duct is configured to direct a gas flow laterally relative to the planarizing zone. The apparatus also includes a pad support carried by the primary duct system, and a polishing pad carried by the pad support. The pad support can have a plurality of apertures that are in fluid communication with the gas flow in the second duct.

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