Apparatuses and methods for polishing semiconductor wafers

Details Apparatuses and methods for polishing semiconductor wafers Apparatuses and methods for polishing semiconductor wafers

1998-09-08

2000-07-25

Scherbel, David A.

Abrading

Abrading process

Glass or stone abrading

451288, 451289, 451528, 451921, B24B 2900

Patent

active

060930853

ABSTRACT:
The present disclosure relates to a polishing pad including a pad structure having at least first and second polishing regions defined along a polishing surface of the pad structure. The first polishing region of the pad structure is less compressible than the second polishing region of the pad structure. The present disclosure also relates to a polish platen including a platen structure having at least first and second regions adapted for supporting a polishing pad. The first region of the platen structure is less compressible than the second region of the platen structure.

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patent: 5645469 (1997-07-01), Burke et al.
patent: 5733176 (1998-03-01), Robinson et al.
patent: 5769699 (1998-06-01), Yu
patent: 5800248 (1998-09-01), Pant et al.
patent: 5853317 (1998-12-01), Yamamoto
patent: 5897424 (1999-04-01), Evans et al.
patent: 5899745 (1999-05-01), Kim et al.
patent: 5899799 (1999-05-01), Tjaden et al.
patent: 5931719 (1999-08-01), Nagahara et al.

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