Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2008-05-20
2008-05-20
Norris, Jeremy C. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S255000, C174S261000, C174S262000, C174S266000, C361S792000, C361S793000, C361S794000, C361S795000, C029S831000, C029S846000
Reexamination Certificate
active
07375288
ABSTRACT:
In some embodiments, apparatuses and methods for improving ball-grid-array solder joint reliability in printed circuit boards. Such apparatuses may comprise, in an exemplary embodiment, a stiffened printed circuit board defining one or more cavities therein and including one or more stiffening members positioned, respectively, in the one or more cavities. The cavities and embedded stiffening members may be located proximate a ball-grid-array device footprint so as to resist deflection caused by the application of forces to the board by test probe pins during testing. Such methods may include, in an exemplary embodiment, creating one or more cavities in a middle sub-layer of a core layer of a stiffened printed circuit board and inserting one or more stiffening members, respectively, therein. Top and bottom sub-layers may then be secured to top and bottom surfaces of the middle sub-layer to complete the core layer. Other embodiments are also described and claimed.
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Ch'ng Sheng Cheang
Rakman Azizi Abdul
Toh Teik Sean
Chen Xiaoliang
Intel Corp.
Norris Jeremy C.
Troutman Sanders LLP
Yancey, Jr. James Hunt
LandOfFree
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