Apparatus to produce a multichip package module in which rough-p

Details Apparatus to produce a multichip package module in which rough-p Apparatus to produce a multichip package module in which rough-p

1999-09-23

2000-09-26

Young, Lee

Metal working

Method of mechanical manufacture

Electrical device making

29940, 29832, H05K 334

Patent

active

061228230

ABSTRACT:
In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough-pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine-pitch bare chips individually, in order to produce the multichip package module.

REFERENCES:
patent: 3216496 (1965-11-01), Katz et al.
patent: 4763405 (1988-08-01), Morita
patent: 4954453 (1990-09-01), Venutolo
patent: 5394609 (1995-03-01), Fergurson et al.
patent: 5526875 (1996-06-01), Lin
Tom Lee T Y et al.--"Compact Liquid Cooling System for Small, Moveable Electronic Equipment" IEEE--vol. 15, No. 5, Oct. 1, 1991--pp. 786-793.

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