Apparatus to minimize integrated circuit heatsink E.M.I. radiati

Details Apparatus to minimize integrated circuit heatsink E.M.I. radiati Apparatus to minimize integrated circuit heatsink E.M.I. radiati

1996-07-24

2000-01-04

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

With means to shield device contained in housing or package...

257706, 257713, 257722, 361818, 174 35R, H01L 23552, H01L 2310, H01L 2334

Patent

active

060112999

ABSTRACT:
A set of conductive plates are positioned adjacent to and in close proximity with a unidirectional heatsink on a high frequency integrated circuit. The set of plates is generally electrically attached to the same ground potential voltage supply as the integrated circuit and serves to damped unwanted radio frequency electromagnetic radiation normally emitted by heatsinks. The same arrangement of plates can also serve as an external electromagnetic interference shield apparatus for the integrated circuit. The plates may alternatively be comprised of a conductive mesh to allow air flow through the plates.

REFERENCES:
patent: 5297007 (1994-03-01), Deyo et al.
patent: 5818101 (1998-10-01), Schuster
"Heat Sink Assembly for Tab-Mounted Devices," pp.372-373, IBM TDB Vo. 31, No. 6, Nov. 1988.

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