Abrading – Abrading process – With tool treating or forming
Reexamination Certificate
2006-06-20
2006-06-20
Morgan, Eileen P. (Department: 3723)
Abrading
Abrading process
With tool treating or forming
C451S443000
Reexamination Certificate
active
07063599
ABSTRACT:
A conditioner includes abrasive elements for conditioning a polishing pad to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes. The abrasive elements are formed from a material that may be degraded or dissolved by at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. The abrasive elements of the conditioner may be degraded or dissolved in at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. Any residue or particles of, or from, the abrasive elements that stick to or become embedded in the polishing pad are removed therefrom by exposing the polishing pad to the at least one chemical so as to degrade or dissolve the residue or particles without substantially degrading or dissolving a material of the polishing pad.
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