Data processing: measuring – calibrating – or testing – Testing system – Of circuit
Reexamination Certificate
2002-11-01
2004-09-14
Shah, Kamini (Department: 2863)
Data processing: measuring, calibrating, or testing
Testing system
Of circuit
C439S091000, C439S591000, C714S726000, C714S030000
Reexamination Certificate
active
06792375
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates generally to an improved testing apparatus and method for use in diagnostic testing of computer systems and, more particularly, to an improved portable or mobile testing apparatus and method for use during diagnostic field testing of integrated circuitry and connected boards.
With ever increasing demands for miniaturization and higher operating speeds, packaging and reliable interconnects are of increasing importance. The trend in miniaturized electronic packaging is to use area array packages for interconnecting integrated circuit packages with boards. One example is the use of a land-grid array (LGA) that is commonly used in the electronics industry for mounting a single-chip module (SCM) to a number of components. The interconnection of a LGA module to a printed wiring board (PWB) requires the accommodation of a high area density of electronic contacts that result in a reliable electronic connection over a wide range of thermal and dynamic operating environments. For effecting such electrical connections, the LGA module is fabricated by aligning the electrical contacts of the LGA module, interposer, and PWB and mechanically compressing them together. High clamping forces, for example exceeding several hundred pounds, are typically provided by a force applying apparatus or mechanism. An advantage of the LGA module is that it is interchangeable and easily upgraded in the field. More recently, LGA's have been used in combination with multiple-chip modules (MCM's) and PWB's. However, achieving a reliable and uniform connection between the components requires significant alignment and relatively high forces that can prove difficult to implement.
For a variety of reasons often attributable to various temperature and dynamic loading factors experienced in the field, computer hardware occasionally fails despite vigorous debugging during manufacturing of components and their assembly. Clearly, the ensuing downtimes are undesirable in many different respects. It is desirable, therefore, to expeditiously determine their source and make the appropriate fixes inexpensively.
Present day testing of computer systems involve the use of diagnostic devices for locating potential sources of system failure. On occasion, the diagnostic testing determines that a potential source of error is broadly the LGA system or perhaps the possibility that the LGA loading system associated therewith that may have been the cause of failure. For example, if a system fails in the field, diagnoses are undertaken. One of the known tests will determine if there are potential connectivity issues in the LGA system that includes the MCM, interposer, and a PWB; as well as the LGA loading system within the computer system that applies loading to the LGA system. The force applying apparatus is extremely important in terms of achieving the connectivity between the matching contacts existing between the MCM, interposer, and PWB and presently there is no known approach for measuring its performance in terms of applying the requisite forces for establishing the desired connectivity. Heretofore, potential connectivity issues that arise in the field in connection with the LGA system are addressed by shipping the computer system to a testing and repair facility in order to determine which if any components of the LGA system and/or LGA loading system are defective. Clearly, the requirement to ship the computer system back for diagnoses represents a significant expense and leads to significant operational downtimes as well as customer dissatisfaction.
Without the ability to conduct successful on-site diagnoses, the potential for reducing downtime of component failures in computer systems is significantly diminished. This is especially the case when diagnosing problems arising in the field relating to the LGA system and/or its loading system.
SUMMARY OF THE INVENTION
In accordance with the present invention, provision is made for a method of testing loading characteristics on an integrated circuit assembly connected to a circuit board. The method comprises the steps of: providing a simulated integrated circuit assembly for use in performing the loading tests; mating an electrical interposer to and between the integrated circuit assembly and a circuit board; applying loading to the mated simulated integrated circuit assembly and circuit board by a force applying apparatus; and, detecting the applied loading forces on the mated simulated circuit assembly and circuit board for determining loading characteristics of a force applying apparatus.
In yet another illustrated embodiment, provision is made for a portable apparatus operable with a force applying apparatus for testing loading characteristics on an integrated circuit assembly coupled to a circuit board. The apparatus comprising: a housing assembly having a size and shape to simulate an integrated circuit module to be tested; a loading element coupled for movement relative to the housing assembly and engageable with a load detecting system for transferring forces to the system in response to forces applied by a force applying apparatus; an interposer which mates the housing assembly to a circuit board; and, a load detecting system at least partially within the housing assembly for providing signals representative of the loading forces applied thereto by a force applying apparatus so that the load delivery characteristics of a force applying apparatus can be determined.
In still another embodiment of the present invention provision is made for a testing system for use in a computer enclosure of a computer system. The testing system comprises: a portable testing apparatus operable with a force applying apparatus for testing loading characteristics on an integrated circuit assembly coupled to a circuit board in the computer system. The testing apparatus is like that described above.
An aspect of the present invention relates to a low-cost testing apparatus and method for use in performing field-testing of electrical interconnections between integrated circuit assemblies and associated circuit boards.
An aspect of the present invention is that it, preferably, allows for field-testing of components in a computer system that heretofore had to be transported from the site for completing testing of defective components.
Another aspect of the present invention relates to a portable or mobile testing apparatus for use in performing field-testing of electrical interconnections between integrated circuit assemblies and printed circuit boards.
A still further aspect of this invention is that it improves a testing process for decreasing the downtime associated with a malfunction of a computer system.
A still further aspect of the present invention is to improve the reliability of finding defects in a LGA system in a computer system.
A still further aspect of this invention is to provide an apparatus which can be used in the field for testing for potential electrical interconnection failures in a LGA system.
Another aspect of the present invention is to allow for the expeditious testing of LGA system including a multiple-chip module (MCM) and a PWB.
A still further aspect of this invention is to allow testing of the force applying system for a LGA system without its removal from the computer system.
A still further aspect of this invention is to provide a cost effective, portable apparatus for debugging system hardware in the field.
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Colbert John Lee
Corbin, Jr. John Saunders
Hamilton Roger Duane
Sinha Arvind Kumar
Payne Leslie J.
Shah Kamini
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