Apparatus, system, and method for wireless connection in...

Details Apparatus, system, and method for wireless connection in... Apparatus, system, and method for wireless connection in...

2006-06-29

2011-12-27

Wilson, Allan R (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S686000, C257SE23023

Reexamination Certificate

active

08084867

ABSTRACT:
Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.

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