Apparatus, system, and method for positioning a printed...

Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component

Reexamination Certificate

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Details

C361S707000, C361S719000, C361S720000, C257S706000, C257S707000, C257S712000, C257S713000

Reexamination Certificate

active

07546943

ABSTRACT:
An apparatus, system, and method are disclosed for positioning a printed circuit board component. A clamping member applies a clamping force to a levering member linked to a positioning member. The levering member biases the positioning member toward a printed circuit board in response to the clamping force. The positioning member positions the printed circuit board and a component disposed on the printed circuit board in response to the positioning member bias. In one embodiment, the positioning member positions the component to contact a thermal device.

REFERENCES:
patent: 5883782 (1999-03-01), Thurston et al.
patent: 6249436 (2001-06-01), Bollesen
patent: 7106594 (2006-09-01), Vetter et al.
patent: 2004/0125570 (2004-07-01), Amber et al.
patent: 2004/0212963 (2004-10-01), Unrein
patent: 2005/0231918 (2005-10-01), Goldmann
patent: 2006/0133041 (2006-06-01), Belady et al.
U.S. Appl. No. 09/951,927, filed Sep. 13, 2001, Dean Frederick Herring, et al.

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