Apparatus of sealing wafer backside for full-face processing

Details Apparatus of sealing wafer backside for full-face processing Apparatus of sealing wafer backside for full-face processing

2006-01-24

2006-01-24

Nguyen, George (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S057000, C451S041000, C451S285000, C451S289000, C451S388000, C451S398000

Reexamination Certificate

active

06988932

ABSTRACT:
The present invention provides a wafer carrier that includes an opening, which in one embodiment is a plurality of holes, disposed along the periphery of the wafer carrier. A gas emitted through the holes onto a peripheral back edge of the wafer assists in preventing the processing liquids and contaminants resulting therefrom from reaching the inner region of the base and the backside inner region of the wafer. In another embodiment, a plurality of concentric sealing members are used to prove a better seal, and the outer seal is preferably independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier.

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