Apparatus of clamping semiconductor devices using sliding...

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder

Reexamination Certificate

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C228S180500

Reexamination Certificate

active

06981629

ABSTRACT:
An apparatus for supporting lead fingers during a wire bonding process and method of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

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“Ultrasonic or Thermosonic Wire Bond Site Stabilization Clamp,” Research Disclosure, Jun. 1986, No. 26622.
Frank P. Incropera et al., “Fundamentals of Heat and Mass Transfer”, Second Edition, pps. 2-12, 1985.

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