Apparatus mounting a power semiconductor to a heat sink

Details Apparatus mounting a power semiconductor to a heat sink Apparatus mounting a power semiconductor to a heat sink

1993-01-26

1994-12-27

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165185, 174 163, 257719, 361713, H05K 720

Patent

active

053770781

ABSTRACT:
An apparatus and a method of mounting a power semiconductor (10) to an external heat sink (18) when both fastening faces (11, 13) of the semiconductor are inaccessible during the assembly process. The apparatus comprises a nut plate (20) that mates with the semiconductor (10) and a thermally conductive layer (28) that engages the nut plate (20) and wraps around the semiconductor (10) in a captive manner. The external heat sink (18) threadably engages the nut plate (20) without the need to access either fastening face (11, 13) of the semiconductor (10).

REFERENCES:
patent: 3911327 (1975-10-01), Murari
patent: 4563725 (1986-01-01), Kirby
patent: 4654754 (1987-03-01), Daszkowski
patent: 4972294 (1990-11-01), Moses, Jr.
patent: 5019942 (1991-05-01), Clemens
patent: 5241453 (1993-08-01), Bright

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