Active solid-state devices (e.g. – transistors – solid-state diode – Superconductive contact or lead – Transmission line or shielded
Reexamination Certificate
2005-06-07
2005-06-07
Thai, Luan (Department: 2829)
Active solid-state devices (e.g., transistors, solid-state diode
Superconductive contact or lead
Transmission line or shielded
C257S663000, C257S664000, C257S665000
Reexamination Certificate
active
06903447
ABSTRACT:
An integrated circuit package houses and connects to a die to form an integrated circuit with internal matching. The package comprises a lead frame comprising at least one transmission line, a die paddle, and at least one input lead and at least one output lead. Bond wires connect select locations along the at least one transmission line to ground through impedance matching circuit components located within the integrated circuit to provide an impedance matching network associated with at least one of the output leads. The package may also substantially encapsulate the lead frame, while exposing the die paddle and the input/output leads.
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Giacchino Richard J.
Schmitz Norbert A.
Struble Wayne M.
M/A-Com Inc.
Thai Luan
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