Apparatus, method and system for thermal management of an unpack

Details Apparatus, method and system for thermal management of an unpack Apparatus, method and system for thermal management of an unpack

1996-08-26

1998-04-07

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 802, 165185, 174 163, 257707, 257713, 257719, 361707, 361710, 361717, 361687, H05K 720

Patent

active

057371873

ABSTRACT:
A thermal management structure to provide mechanical isolation and heat removal for a unpackaged semiconductor die mounted directly on a printed circuit board substrate. The thermal management structure sandwiches the unpackaged semiconductor die and substrate between two heat sink pieces which are rigidly mounted to the substrate, thereby mechanically isolating the unpackaged semiconductor die and preventing the die from being accidentally touched. The two heat sink pieces further compliantly thermally engage selected sites on the exposed face of the semiconductor die and the surface of the substrate to conductively remove heat away from the substrate. The thermal management structure may also thermally engage selected thermally conductive components within an end product to spread the heat more uniformly throughout the system.

REFERENCES:
patent: 4756081 (1988-07-01), Penn
patent: 5272599 (1993-12-01), Koenen
patent: 5557500 (1996-09-01), Baucom et al.
patent: 5559675 (1996-09-01), Hsieh et al.
patent: 5581443 (1996-12-01), Nakamura et al.
patent: 5590026 (1996-12-01), Warren et al.
patent: 5619399 (1997-04-01), Mok

Affiliated with

Also associated with

Rating

Apparatus, method and system for thermal management of an unpack does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus, method and system for thermal management of an unpack, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus, method and system for thermal management of an unpack will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-18845