Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-04-27
2000-05-02
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361688, 361689, 361690, 361694, 361695, 361698, 361699, 361700, 361720, 165 803, 165 804, 174 161, 174 163, 174 152, 174 151, 395556, H05K 720
Patent
active
060580127
ABSTRACT:
A thermal management controller to regulate the operating temperature of high speed, high circuit density semiconductor dice in an electronic product. The thermal management controller monitors the temperature of a heat sink in thermal contact with the high speed, high circuit density semiconductor dice and also monitors the operational status of one or more specified devices which may increase the heat load within the electronic product. As the temperature of the heat sink increases and/or as specified devices increase the heat load in the electronic product, the thermal management controller will start cooling fans and/or increases the speed of the cooling fans to increase heat removal from the electronic product by forced convection. As the temperature of the heat sink decreases and/or as specified devices cease contributing to the heat load in the electronic product, the thermal management controller will decrease the speed of the cooling fans and/or turn off the cooling fans to decrease heat removal from the electronic product. If the temperature of the heat sink rises above a predetermined temperature, the thermal management structure will reduce the clock speed of the semiconductor dice. If the temperature of the heat sink rises above a predetermined maximum temperature, the thermal management structure will turn of the semiconductor dice.
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Cooper Patrick R.
Hallowell William C.
Nguyen Minh H.
Progl Curtis
Tracy Mark S.
Chervinsky Boris L.
Compaq Computer Corporation
Katz Paul N.
Picard Leo P.
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