Apparatus, method and system for thermal management of a semicon

Details Apparatus, method and system for thermal management of a semicon Apparatus, method and system for thermal management of a semicon

1998-04-03

1999-07-27

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361689, 361699, 361700, 361709, 361710, 361719, 361720, 257706, 257714, 257715, 257717, 165 804, 165185, 174 151, 174 152, 174 163, H05K 720

Patent

active

059301155

ABSTRACT:
A thermal management structure to provide mechanical isolation and heat removal for an unpackaged semiconductor die mounted directly on a printed circuit board substrate. The thermal management structure sandwiches the unpackaged semiconductor die and substrate between two heat sink pieces which are rigidly mounted to the substrate, thereby mechanically isolating the unpackaged semiconductor die and preventing the die from being accidentally touched. The two heat sink pieces further compliantly thermally engage selected sites on the exposed face of the semiconductor die and the surface of the substrate to conductively remove heat away from the substrate. The thermal management structure may also provide electromagnetic shielding which isolates the electromagnetic fields generated by the substrate from electromagnetic fields external to the thermal management structure. The thermal management structure may also thermally engage selected thermally conductive components within an end product to spread the heat more uniformly throughout the system.

REFERENCES:
patent: 4758926 (1988-07-01), Herrell et al.
patent: 5475563 (1995-12-01), Donahoe et al.
patent: 5757615 (1998-05-01), Donahoe et al.
patent: 5764483 (1998-06-01), Ohashi et al.
patent: 5784256 (1998-07-01), Nakamura et al.

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