Apparatus integrating pad conditioner with a wafer carrier for c

Details Apparatus integrating pad conditioner with a wafer carrier for c Apparatus integrating pad conditioner with a wafer carrier for c

1996-10-21

1999-05-25

Dang, Thi

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

438692, 156345, B24B 3700, B24B 700, B24B 100

Patent

active

059067543

ABSTRACT:
An apparatus integrating pad conditioning device (44) with a wafer carrier device (24) for chemical-mechanical polishing applications includes an attaching mechanism (45) for associating conditioning device (44) with wafer carrier device (24). Conditioning surface (84) of conditioning device (44) conditions the polishing pad associates with attaching mechanism (45). Carrier device (24) receives and holds wafer (42) so that wafer (42) and conditioning surface (44) contact the polishing pad (42) to simultaneously condition polishing pad (26) and polish wafer (42).

REFERENCES:
patent: 5032203 (1991-07-01), Doy et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5522965 (1996-06-01), Chisholm
patent: 5536202 (1996-07-01), Appel et al.
patent: 5569062 (1996-10-01), Karlsrud
patent: 5688364 (1997-11-01), Sato
patent: 5749771 (1998-05-01), Isobe

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