Apparatus including heat sink structure for removing heat from a

Details Apparatus including heat sink structure for removing heat from a Apparatus including heat sink structure for removing heat from a

1998-05-11

1999-09-14

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361687, 361688, 361689, 361696, 361698, 361699, 361701, 361720, 165 803, 165 804, 174 151, H05K 720

Patent

active

059532114

ABSTRACT:
An apparatus, such as a computer, comprises a housing having an interior portion into which a printed circuit board may be inserted. The printed circuit board, when inserted, is supported by a support structure. A spring mechanism resiliently supports a heat sink structure in contact with a major side portion of the inserted printed circuit board. During operation, fluid flows in thermal transfer relationship with the heat sink structure. In this manner, heat is transferred from the heat sink structure to the fluid.

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