Apparatus including a fluid coupler interfaced to a test head

Details Apparatus including a fluid coupler interfaced to a test head Apparatus including a fluid coupler interfaced to a test head

2011-01-18

2011-01-18

Williams, Hezron (Department: 2856)

Measuring and testing

Probe or probe mounting

C324S760020

Reexamination Certificate

active

07870800

ABSTRACT:
One embodiment of the present invention is an apparatus including a fluid coupler interfaced to a test head that includes: (a) a first ring having a top surface disposed in a first plane; (b) a first movable ring, the first movable ring being movable substantially normal to the first plane relative to the first ring; (c) a first flexible diaphragm attached to the first ring along a first attachment perimeter that encloses a first effective surface area, the first flexible diaphragm being attached to the first movable ring; (d) a second ring having a top surface disposed in a second plane; (e) a second movable ring, the second movable ring being movable substantially normal to the first plane; and (f) a second flexible diaphragm attached to the second ring along a second attachment perimeter that encloses a second effective surface area, the second flexible diaphragm being attached to the second movable ring; wherein: (i) the first flexible diaphragm and the second flexible diaphragm form a first channel for fluid flow, there being an intake aperture in the first channel and an exhaust aperture in the first channel; (ii) the test head has an intake channel to internal fluid channels and an exhaust channel from the internal fluid channels, and the test head is movable substantially normal to the first plane; (iii) the first plane is substantially parallel to the second plane; and (iv) the intake aperture in the test head is alignable with the exhaust aperture in the first channel.

REFERENCES:
patent: 3724536 (1973-04-01), Baxter
patent: 4381032 (1983-04-01), Cutchaw
patent: 4468717 (1984-08-01), Mathias et al.
patent: 4729060 (1988-03-01), Yamamoto et al.
patent: 4783721 (1988-11-01), Yamamoto et al.
patent: 4820976 (1989-04-01), Brown
patent: 4926118 (1990-05-01), O'Connor et al.
patent: 4933747 (1990-06-01), Schroeder
patent: 4964458 (1990-10-01), Flint et al.
patent: 5164661 (1992-11-01), Jones
patent: 6373133 (2002-04-01), DiGiacomo et al.
patent: 6392431 (2002-05-01), Jones
patent: 6587345 (2003-07-01), Chu et al.
patent: 6975028 (2005-12-01), Wayburn et al.
patent: 6993922 (2006-02-01), Wall et al.
patent: 7017358 (2006-03-01), Wayburn et al.
patent: 7100389 (2006-09-01), Wayburn et al.
patent: 2002/0088113 (2002-07-01), Hwang
patent: 2005/0155219 (2005-07-01), Hwang
patent: 2004008053 (2004-01-01), None
“Thermal Conduction Module Cooling” IBM Tech Disc. Bull. p. 531, Jul. 1983.

Affiliated with

Also associated with

Rating

Apparatus including a fluid coupler interfaced to a test head does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus including a fluid coupler interfaced to a test head, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus including a fluid coupler interfaced to a test head will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2677149