Metal fusion bonding – Process – Bonding nonmetals with metallic filler
Patent
1995-10-31
1997-05-27
Ramsey, Kenneth J.
Metal fusion bonding
Process
Bonding nonmetals with metallic filler
313105CM, H01J 4300
Patent
active
056324367
ABSTRACT:
A photomultiplier tube, image intensifier tube, or night vision device includes a cascade of plural microchannel plates which are physically and electrically connected together to provide an electron multiplication through the microchannel plate cascade. At least two adjacent microchannel plates in the cascade are also physically interbonded to one another. The bonding of the adjacent microchannel plates may be accomplished by use of a metallic interbonding layer covering all except a peripheral edge portion of at least one face of one or both of the bonded microchannel plates, which interbonding layer confronts and bonds with the other of the bonded microchannel plates. The interbonding layer may cover only a peripheral annular portion of the one face of the one bonded microchannel plate, or only sub-areas of this peripheral annular portion of this one microchannel plate. During manufacturing of such an image intensifier tube, the microchannel plates are initially fabricated and handled as individuals. However, a necessary manufacturing step for the tube also results in the microchannel plates interbonding to one another.
REFERENCES:
patent: 3567947 (1971-03-01), Robbins
patent: 4005920 (1977-02-01), Wimmer
patent: 4293986 (1981-10-01), Kobayashi et al.
patent: 4482836 (1984-11-01), Washington et al.
patent: 4737623 (1988-04-01), Uhl
patent: 4825118 (1989-04-01), Kyushima
patent: 4863759 (1989-09-01), Warde et al.
patent: 4886996 (1989-12-01), Field et al.
patent: 4895291 (1990-01-01), Ozimek et al.
patent: 5097173 (1992-03-01), Schmidt et al.
patent: 5378640 (1995-01-01), Kim
Manko Solders and Soldering 2nd Ed McGraw-Hill Book Co 1979 pp. 115-119.
Litton Systems
Ramsey Kenneth J.
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