Apparatus for wirebonding using a tubular piezoelectric ultrason

Details Apparatus for wirebonding using a tubular piezoelectric ultrason Apparatus for wirebonding using a tubular piezoelectric ultrason

1996-03-14

1998-07-07

Ramsey, Kenneth J.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

2281805, B23K 2010

Patent

active

057755671

ABSTRACT:
In ultrasonic wirebonding apparatus, vibrations produced using a tubular piezoelectric (piezoceramic) actuator, driven by electrical current at an ultrasonic frequency, are used to provide energy for the wirebonding process. An assembly including means for mounting the actuator at a proximal end, the actuator itself, and a bonding tip extending from a distal end of the actuator, are moved by a carrier between the various points at which wirebonding is to occur. The bonding wire is fed through a passageway in this assembly. The carrier slides on a first carriage for movement into engagement with the workpiece. The first carriage slides in a first direction on a second carriage, which in turn slides in a second direction, to move between points at which wirebonding is to occur. The workpieces, such as circuit chips being manufactured, are moved into a workspace for wirebonding, are held therein during processing, and are subsequently removed from the workspace.

REFERENCES:
patent: 3357090 (1967-12-01), Tiffany
patent: 3384283 (1968-05-01), Mims
patent: 3401861 (1968-09-01), Folk
patent: 4437604 (1984-03-01), Razon et al.
patent: 4877173 (1989-10-01), Fujimoto et al.
patent: 5201453 (1993-04-01), Amador et al.
patent: 5263630 (1993-11-01), Kanomata et al.

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