Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Patent
1978-11-22
1980-12-16
Crane, Daniel C.
Metal fusion bonding
Means to apply vibratory solid-state bonding energy to work
228 45, 228904, 219 5621, 219 85F, 403165, 403127, 74479, 1565801, B23K 1904
Patent
active
042391440
ABSTRACT:
A wire bonding machine for wedge bonding fine wires to semiconductor devices is provided with a rotating bonding head which is mounted on a fixed machine frame and having a X-Y table mounted on the fixed machine frame opposite a vertically movable bonding tool mounted on the rotating bonding head. The bonding head is provided with means for articulating the bonding tool in a vertical direction and in a rotational direction. The rotational movement of the novel bonding head does not impart vertical movement to the bonding tool.
REFERENCES:
patent: 1086145 (1914-02-01), Dodds
patent: 2946120 (1960-07-01), Jones et al.
patent: 3125906 (1964-03-01), Johnson
patent: 3242029 (1966-03-01), Deans
patent: 3409977 (1968-11-01), Johnson
patent: 3960309 (1976-06-01), Hazel
patent: 3997100 (1976-12-01), Hofmeister
Elles Richard J.
Kulicke, Jr. Frederick W.
Sade Moshe E.
Soffa Albert
Crane Daniel C.
Farrell Edward M.
Kulicke & Soffa Industries Inc.
LandOfFree
Apparatus for wire bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for wire bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for wire bonding will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-603079