Apparatus for wire bonding

Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work

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Details

228 45, 228904, 219 5621, 219 85F, 403165, 403127, 74479, 1565801, B23K 1904

Patent

active

042391440

ABSTRACT:
A wire bonding machine for wedge bonding fine wires to semiconductor devices is provided with a rotating bonding head which is mounted on a fixed machine frame and having a X-Y table mounted on the fixed machine frame opposite a vertically movable bonding tool mounted on the rotating bonding head. The bonding head is provided with means for articulating the bonding tool in a vertical direction and in a rotational direction. The rotational movement of the novel bonding head does not impart vertical movement to the bonding tool.

REFERENCES:
patent: 1086145 (1914-02-01), Dodds
patent: 2946120 (1960-07-01), Jones et al.
patent: 3125906 (1964-03-01), Johnson
patent: 3242029 (1966-03-01), Deans
patent: 3409977 (1968-11-01), Johnson
patent: 3960309 (1976-06-01), Hazel
patent: 3997100 (1976-12-01), Hofmeister

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