Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Patent
1980-08-15
1982-11-30
Ramsey, Kenneth J.
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
29407, 228179, H01L 21607, B23K 3702
Patent
active
043612610
ABSTRACT:
A wire bonding machine for wedge bonding fine wires to semiconductor devices is provided with a rotating bonding head which is mounted on a fixed machine frame and having a X-Y table mounted on the fixed machine frame opposite a vertically movable bonding tool mounted on the rotating bonding head. The bonding head is provided with means for articulating the bonding tool in a vertical direction and in a rotational direction. The rotational movement of the novel bonding head does not impart vertical movement to the bonding tool.
REFERENCES:
patent: 3044322 (1962-07-01), George
patent: 3167866 (1965-02-01), Steineman
patent: 3960309 (1976-06-01), Hazel
patent: 3997100 (1976-12-01), Hofmeister
Elles Richard J.
Kulicke, Jr. Frederick W.
Sade Moshe E.
Soffa Albert
Farrell Edward M.
Kulicke & Soffa Industries Inc.
Ramsey Kenneth J.
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