Apparatus for wet treatment of wafer materials

Details Apparatus for wet treatment of wafer materials Apparatus for wet treatment of wafer materials

1981-07-01

1983-06-14

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156639, B44C 122, C03C 1500, C03C 2506

Patent

active

043881408

ABSTRACT:
The invention provides a novel apparatus for the wet treatment, e.g. chemical etching treatment, of a plural number of wafer materials such as wafers of high purity silicon semiconductors. The apparatus comprises a liquid tub for containing the treatment liquid, e.g. etching solution, a pair of screw shafts horizontally held in the liquid tub in parallel with each other to be rotatable in the same direction at the same velocity to serve as a kind of screw conveyor and a traveling drum carriage mounted on the screw shafts as engaged with the threads of the shafts at the circular end plates so as to be rotated and transferred in the treatment liquid simultaneously as the screw shafts rotate. The traveling drum carriage holds a wafer basket containing a plural number of the wafer materials perpendicularly to the axis so that the wafer materials are also rotated together with the rotation of the carriage and the surfaces of them are always in contact with the treatment liquid during traveling from one end of the screw shafts to the other.

REFERENCES:
patent: 3964957 (1976-06-01), Walsh
patent: 4113543 (1978-09-01), Salles et al.

Affiliated with

Also associated with

Rating

Apparatus for wet treatment of wafer materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for wet treatment of wafer materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for wet treatment of wafer materials will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-162400