Apparatus for wave soldering printed wiring boards

Details Apparatus for wave soldering printed wiring boards Apparatus for wave soldering printed wiring boards

1996-07-19

1998-06-23

Paumen, Gary F.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228 42, B23K 306, B23K 3538

Patent

active

057693056

ABSTRACT:
A soldering device includes a solder vessel for containing a molten solder, solder ejecting nozzle disposed in the solder vessel for upwardly ejecting the molten solder to form a solder wave thereabove, a cover plate covering the vessel and having an opening such that the solder wave can pass therethrough, a nozzle forming body provided adjacent at least one side of the solder wave to define a thin space between the nozzle forming body and the cover plate, and a gas feed conduit connected to the nozzle forming body for feeding a gas to the thin space, so that the gas is jetted through the thin space and flows toward the solder wave.

REFERENCES:
patent: 3705457 (1972-12-01), Tardoskegyi
patent: 5203489 (1993-04-01), Gileta et al.
patent: 5228614 (1993-07-01), Elliott et al.
patent: 5240169 (1993-08-01), Gileta et al.
patent: 5294036 (1994-03-01), Den Dopper
patent: 5388752 (1995-02-01), Kawakatsu
patent: 5409159 (1995-04-01), Connors et al.
patent: 5411200 (1995-05-01), Connors et al.

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