Apparatus for wafer processing with in situ rinse

Metal working – Barrier layer or semiconductor device making

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Details

156646, 134144, 134149, 134151, 134154, 134155, 134157, 134177, 134182, 134902, B08B 302, B08B 500, B21F 4100

Patent

active

051694085

ABSTRACT:
A wafer processing apparatus including a head defining an etching chamber, the sidewall of the head being slidable along the base so that the sidewall and base will normally define an etch chamber; and the sidewall may be moved upwardly to open a discharge passage for rinsing water, and a deflecting surface for deflecting the rinsing water downwardly and draining the rinsing water from the passage. The housing is separable above the deflector ring to provide access to the wafer for inserting the wafer and replacing it.

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patent: 4857142 (1989-08-01), Syverson
Then, W., "Apparatus For Cleaning & Drying Wafers", IBM Technical Disc. Bulletin, vol. 25, No. 6, Nov. 1982, pp. 2735.
Skidmore, K., "Cleaning Techniques For Wafer Surfaces", Semiconductor International, Aug. 1987 pp. 80-85.

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