Apparatus for vapor-cooling a semiconductor

Details Apparatus for vapor-cooling a semiconductor Apparatus for vapor-cooling a semiconductor

1986-04-09

1987-09-15

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

361382, 165 804, 357 81, H01L 2504

Patent

active

046943234

ABSTRACT:
A semiconductor stack is composed of a GTO thyristor, cooling members and wiring conductors which are stacked and tightened together. The semiconductor stack is disposed horizontally in a cooling vessel, and the vessel is filled with a Freon liquid. A condenser is disposed above the cooling vessel and is connected to the cooling vessel by a communication tube, to constitute a cooling apparatus. Each cooling member has a large number of small holes between the GTO thyristor and the wiring conductors between which the cooling member is disposed. The Freon is boiled in the small holes by the heat generated at the GTO thyristor, becomes Freon vapor, and is directed toward the corresponding wiring conductor. Each wiring conductor has a large number of longitudinal slits on the surface thereof which is in contact with the cooling member. The Freon vapor is made to flow upward along these slits by convection currents, thereby increasing the efficiency of the cooling cycle provided by the liquid Freon refrigerant.

REFERENCES:
patent: 4028723 (1977-06-01), Shikano

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