Apparatus for use in cooling integrated circuit chips

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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361385, H05K 720

Patent

active

045517878

ABSTRACT:
An integrated circuit chip is cooled by being mounted on a substrate which is urged into contact with a compliant mat which includes a layer having a predetermined array of interconnected metallic pads for spreading heat flux more uniformly. The mat is connected to a plate which may be water cooled. The mat also includes additional layers which are heat conductive and electrically insulative. One of the additional layers is a film of paste.

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