Abrading – Precision device or process - or with condition responsive... – Computer controlled
Patent
1997-11-12
2000-11-14
Eley, Timothy V.
Abrading
Precision device or process - or with condition responsive...
Computer controlled
451 11, 451 24, 451159, 451288, B24B 4900
Patent
active
061462411
ABSTRACT:
Methods and apparatuses for evenly polishing the entire polishing surface of a sample are described. One polishing apparatus of the present invention comprises: a platen having an upper surface upon which the sample surface is to be polished; a sample holder disposed opposite to the platen's upper surface, at least one of the platen and the sample holder being rotated about a first axis to effect polishing; a positioning means for changing the distance between the sample holder and the platen in response to a control signal; and a controller providing said control signal to the positioning means to control the operation of the positioning means during a polishing cycle, wherein the controller causes the positioning means to change the distance intermittently during the polishing cycle. One method according to the present invention comprises: dispensing slurry upon a polishing pad; polishing the sample against the polishing pad; and intermittently changing the distance between the sample and the polishing pad during the polishing step.
REFERENCES:
patent: 3582740 (1971-06-01), Reinert
patent: 3815226 (1974-06-01), Marrie
patent: 3857123 (1974-12-01), Walsh
patent: 3977130 (1976-08-01), Degner
patent: 4193226 (1980-03-01), Gill, Jr. et al.
patent: 4422029 (1983-12-01), Demers et al.
patent: 4886990 (1989-12-01), Barker
patent: 4910155 (1990-03-01), Cote et al.
patent: 4918870 (1990-04-01), Torbert et al.
patent: 5020283 (1991-06-01), Tuttle
patent: 5104828 (1992-04-01), Morimoto et al.
patent: 5113622 (1992-05-01), Nishiguchi
patent: 5142828 (1992-09-01), Curry, II
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5234867 (1993-08-01), Schultz et al.
patent: 5297364 (1994-03-01), Tuttle
patent: 5299393 (1994-04-01), Chandler et al.
patent: 5377451 (1995-01-01), Leoni et al.
patent: 5384986 (1995-01-01), Hirose et al.
patent: 5403228 (1995-04-01), Pasch
patent: 5441444 (1995-08-01), Nakajima
patent: 5443416 (1995-08-01), Volodarsky et al.
patent: 5476414 (1995-12-01), Hirose et al.
patent: 5487697 (1996-01-01), Jensen
patent: 5498196 (1996-03-01), Karlsrud et al.
patent: 5498199 (1996-03-01), Karlsrud et al.
patent: 5542874 (1996-08-01), Chikaki
patent: 5816895 (1998-10-01), Honda
patent: 5851135 (1998-12-01), Sandhu et al.
Beilin Solomon I.
Lee Michael G.
Eley Timothy V.
Fujitsu Limited
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