Apparatus for ultrasonic wire bonding

Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work

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Details

228 45, 228 45, 228110, 219 5621, B23K 2010

Patent

active

047920793

ABSTRACT:
The invention relates to an apparaus for ultrasonic wire bondings whereby the contact loci can be connected by wire straps, by means of ultrasonic welding, e.g. for connecting terminals on component mounts or the like to bonding islands on semiconductor chips. The inventive apparatus has means for combined axial and radial guiding of the rotatable bonding head, with low overall mass of the vertically movable parts and low moment of inertia around the rotational axis. As a result of the inventive disposition of the microscope objective, the object distance to the component can be set directly via the controllable vertical drive of the bonding head.

REFERENCES:
patent: 4239144 (1980-12-01), Elles et al.
patent: 4351468 (1982-09-01), Floury et al.

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