Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Patent
1991-09-05
1993-01-19
Heinrich, Samuel M.
Metal fusion bonding
Means to apply vibratory solid-state bonding energy to work
228 55, B23K 2010
Patent
active
051800934
ABSTRACT:
An ultrasonic transducer, bonding tool and method of bonding gold or gold plated leads to gold or gold plated bonding pads located on unheated substrates is disclosed. More particularly, the transducer of the present invention incorporates a modified transducer/tool interface which provides for increased durability as well as increased excursion control of any bonding tool placed therein. The bonding tool of the present invention includes a modified end having a raised pattern used to form an impression in the lead to be bonded to enhance gripping of the lead during bonding. The preferred methods include using the modified transducer and bonding tool to perform gold-to-gold bonding on unheated substrates while providing increased vertical clearance for bonding between structures.
REFERENCES:
patent: 209252 (1878-10-01), Gill
patent: 228811 (1880-06-01), Goodell
patent: 483865 (1892-10-01), Potter et al.
patent: 776250 (1904-11-01), Mathieu et al.
patent: 2073430 (1937-03-01), Tautz
patent: 2452211 (1948-10-01), Rosenthal
patent: 3610506 (1971-10-01), Robinson
patent: 3747198 (1973-07-01), Benson et al.
patent: 3954217 (1976-05-01), Smith
patent: 4591087 (1986-05-01), Frasch
Small Precision Tools, a brochure entitled Thermosonic Capillaries for Fine Pitch Bonding, 1 p. labelled Exhibit A.
Small Precision Tools, a brochure entitled Tip Style TS70 Thermosonic (T/S) Tailless Capillary Bonding Tips, 1 p. labelled Exhibit B.
Small Precision Tools, a brochure entitled Ultrasonic Gold Wire Bonding Tools, 1 p. labelled Exhibit C.
Small Precision Tools, a brochure entitled AutoBonding Tool.RTM., 1 p. labelled Exhibit D.
Seitz Michael R.
Stansbury Randall R.
Cray Research Inc.
Heinrich Samuel M.
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