Apparatus for troubleshooting photoimage plating problems in pri

Details Apparatus for troubleshooting photoimage plating problems in pri Apparatus for troubleshooting photoimage plating problems in pri

1989-04-28

1990-06-19

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204434, C25D 502, C25D 1700

Patent

active

049351087

ABSTRACT:
An apparatus and method are disclosed for testing electrodeposition processes used in printed circuit board manufacture. The apparatus, having a photoresist pattern on a test printed circuit board, for use in a Hull Cell to determine efficiency, uniformity, and interactions of the process on the surface of the printed circuit board in order to provide for design rules and process specifications.

REFERENCES:
Nohse, Walter, "The Hull Cell", Robert Draper LTD, 1966, pp. 1-25.
Englemaier, Werner; Kessler, Thomas; Alkire, Richard; "Current Distribution Leveling Resulting from Auxiliary Bipolar Electrodes", Journal of Electrochemical Society; Electrochemical Science and Technology, pp. 209-216, Feb. 1978.
Rohlev, S.; Pierce, P; Yost, C.; Meck, M; "Effect of Composition on Current and Metal Distribution and Efficiency in a Gold Plating Solution", The Electrochemical Society Extended Abstracts, pp. 793-794, Oct. 11-16, 1981.

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