Apparatus for treatment of semiconductor wafer

Details Apparatus for treatment of semiconductor wafer Apparatus for treatment of semiconductor wafer

1975-07-28

1977-04-19

Stein, Mervin

Coating apparatus

With cutting, punching or tearing of work

Web or sheet work

118 4, C23C 1312

Patent

active

040181847

ABSTRACT:
An apparatus for treatment of a semiconductor wafer comprises a sealable treating vessel which forms a sealed treating chamber in the vessel when sealed. A gas feeder feeds a compressed gas to the treating chamber. A heating device is disposed out of the treating chamber. The semiconductor wafer in the treating chamber is treated with the compressed gas while it is heated by the heating device.

REFERENCES:
patent: 1601931 (1926-10-01), VanArkel
patent: 2792438 (1957-05-01), Dunn
patent: 2873222 (1959-02-01), Derick et al.
patent: 3293074 (1966-12-01), Nickl
patent: 3330251 (1967-07-01), Gutsche
patent: 3554162 (1971-01-01), Cota et al.
patent: 3657006 (1972-04-01), Fisher et al.
patent: 3658032 (1972-04-01), Kohler et al.
patent: 3659552 (1972-05-01), Briody
patent: 3705567 (1972-12-01), Emels
patent: 3918396 (1975-11-01), Dietze et al.
IBM Technical Disclosure Bulletin, "Waterinjection System for Thermal Oxidation of Semiconductors," Kemnitz, et al., vol. 17, No. 9, (Feb. 1975), p. 2664.

Affiliated with

Also associated with

Rating

Apparatus for treatment of semiconductor wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for treatment of semiconductor wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for treatment of semiconductor wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-97584