Apparatus for treating wafers with process fluids

Details Apparatus for treating wafers with process fluids Apparatus for treating wafers with process fluids

1988-10-03

1990-04-17

Stinson, Frankie L.

Cleaning and liquid contact with solids

Apparatus

With plural means for supplying or applying different fluids...

134 98, 134100, 134103, B08B 304

Patent

active

049171232

ABSTRACT:
Contamination of wafers is reduced by an enclosed full-flow method and apparatus for the cleaning and other wet processing of semiconductor wafers. Process fluids flow sequentially and continuously past the wafers such that the processing does not require movement or operator handling of the wafers between processing steps. The vessel containing the wafers is hydraulically full during each process step. Wafers may be cleaned using a hot corrosive fluid, such as sulfuric acid; rinsed using high purity water at high flow rates; and dried using a drying fluid such as isopropanol. In addition, chemical reagents such as dilute hydrofluoric acid or hydrogen peroxide may be precisely mixed in situ and applied to the wafer surface for a precisely controlled period, by injecting concentrated reagent into rinse water purified by multipass filtration.

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