Apparatus for treating substrate

Details Apparatus for treating substrate Apparatus for treating substrate

2008-01-29

2008-01-29

MacArthur, Sylvia R. (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With gas inlet structure

C156S345210, C156S345390, C156S345420

Reexamination Certificate

active

07323080

ABSTRACT:
The present is directed to an apparatus for etching the top edge and bottom of a wafer. The apparatus includes a substrate support part for supporting a wafer and a movable protect part for preventing fluid for an etch from flowing into a non-etch portion of the wafer. The top edge and bottom of the wafer is etched by a wet etch, and a boundary of the non-etch portion and the edge of the wafer is etched by a dry etch.

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