Apparatus for transferring workpieces

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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118728, 156643, 156646, 204298, B44C 122, C03C 1500, C03C 2506, C23F 102

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active

048160989

ABSTRACT:
A processing apparatus and method for transferring wafers or flat workpieces between a controlled vacuum load lock and a non-vacuum transfer mechanism. The apparatus is adapted to receive the wafers in a carrier under vacuum. The load lock chamber of the apparatus is then pumped down and purged, if desired. Next the chamber is brought to ambient pressure and an opening to the chamber is created. A transfer arm within the chamber transfers the wafers from the carrier through the opening and to a platform or an non-vacuum carrier. The wafers are received by the arm outside the chamber and transferred through the opening and placed into the vacuum carrier within the chamber. The opening into the chamber is closed and a vacuum is generated. The chamber can then be purged, if desired and the vacuum carrier sealed. The carrier can now be removed from the load lock chamber.

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