Apparatus for thermally coupling a heat dissipation device...

Details Apparatus for thermally coupling a heat dissipation device... Apparatus for thermally coupling a heat dissipation device...

2007-03-06

2007-03-06

Trinh, Minh (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S729000, C029S740000, C029S743000, C029S840000, C156S285000, C156S379600, C156S381000, C156S382000, C219S243000, C228S180210

Reexamination Certificate

active

10165395

ABSTRACT:
An apparatus is provided for thermally coupling a heat dissipation device to a microelectronic device. A thermal compression bonding apparatus is provided comprising a bonding head adapted to apply heat and pressure to the heat dissipation device to provide the desired thermal profile to effect solidification of the interface material from the center outward.

REFERENCES:
patent: 4284466 (1981-08-01), Chayka et al.
patent: 5197651 (1993-03-01), Nakamura et al.
patent: 5230462 (1993-07-01), Vascak et al.
patent: 6347734 (2002-02-01), Downes
patent: 08-218166 (1996-08-01), None

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