Apparatus for thermal treatment of a wafer in an evacuated envir

Details Apparatus for thermal treatment of a wafer in an evacuated envir Apparatus for thermal treatment of a wafer in an evacuated envir

1987-04-16

1990-03-20

Lazarus, Ira S.

Heat exchange

With retainer for removable article

Electrical component

118725, 20419212, 204298, F28F 700

Patent

active

049093142

ABSTRACT:
In a vacuum chamber wafer treating apparatus, a wafer is heated or cooled by introducing a gas at a pressure of approximately 100 to 1000 microns in a region between the wafer and a heating element or heat sink. The gas conducts thermal energy between the wafer and heating element or heat sink.

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