Coating apparatus – With vacuum or fluid pressure chamber
Patent
1976-08-16
1978-02-28
Stein, Mervin
Coating apparatus
With vacuum or fluid pressure chamber
118 491, 118500, 214 1BB, 427248G, 432253, C23C 1312
Patent
active
040759725
ABSTRACT:
The invention discloses an apparatus for thermal diffusion of semiconductor devices, wherein a plurality of wafer boats each made of a refractory material and adapted to carry a predetermined number of wafers to be processed are sequentially fed into a furnace tube containing a high temperature, diffusion gas atmosphere and continuously transported at a predetermined speed through the furnace tube so that each wafer may have substantially the same thermal treatment and high productivity may be attained.
REFERENCES:
patent: 3051811 (1962-08-01), Koesling
patent: 3202406 (1965-08-01), Tack
patent: 3473510 (1969-10-01), Sheng et al.
patent: 3645545 (1972-02-01), Garnache et al.
patent: 3710757 (1973-01-01), Porter
patent: 3744650 (1973-07-01), Henebry et al.
patent: 3811825 (1974-05-01), Enderlein
patent: 3819067 (1974-06-01), Hammond
patent: 3951587 (1976-04-01), Alliegro et al.
patent: 3982888 (1976-09-01), Moussou et al.
Aoki Katsuo
Hara Kunihiko
Ina Osamu
Oka Yoshio
Suzuki Takao
Nippondenso Co. Ltd.
Stein Mervin
LandOfFree
Apparatus for thermal diffusion of semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for thermal diffusion of semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for thermal diffusion of semiconductor devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1669867