Thermal measuring and testing – Temperature measurement – Temperature distribution or profile
Reexamination Certificate
2008-03-14
2011-10-18
Tyler, Cheryl J (Department: 3744)
Thermal measuring and testing
Temperature measurement
Temperature distribution or profile
C374S005000, C374S121000, C374S141000, C324S537000, C324S750100, C324S750030, C324S762010, C324S762020, C062S259200
Reexamination Certificate
active
08038343
ABSTRACT:
A novel computer program product and method for thermally characterizing a device used for cooling an electronic device is disclosed. A cooling device, being operated, is thermally coupled to a heat pipe having a surface to receive a test chip. A heater is patterned on a circuitry side of the test chip. The heater is separate from operational circuitry of the test chip. A localized heat source is applied to at least one region on a test chip thermally coupled to the heat pipe to locally heat more than one region on a second surface of the test chip to test more than one hot spot. The second surface is the circuitry side of the test chip. The heater provides a bias heat to the test chip, independent of operating the test chip, while the localized heat source is selectively applied directly to the test chip. A temperature detector is used to measure a temperature distribution on the second surface of the test chip. The temperature distribution is used to thermally characterize said cooling device during operation.
REFERENCES:
patent: 3504524 (1970-04-01), Maley
patent: 4633371 (1986-12-01), Nagy et al.
patent: 5880524 (1999-03-01), Xie
patent: 5969639 (1999-10-01), Lauf et al.
patent: 5971608 (1999-10-01), Koizumi
patent: 6163161 (2000-12-01), Neeb
patent: 6251706 (2001-06-01), Paniccia
patent: 6418393 (2002-07-01), Lu et al.
patent: 6663278 (2003-12-01), Chien et al.
patent: 6804622 (2004-10-01), Bunker et al.
patent: 6836131 (2004-12-01), Cader et al.
patent: 6917039 (2005-07-01), Nicolaides et al.
patent: 6995980 (2006-02-01), Tustaniwskyj et al.
patent: 7330041 (2008-02-01), McFadden
patent: 2002/0118032 (2002-08-01), Norris et al.
patent: 2004/0012404 (2004-01-01), Feder et al.
patent: 2004/0065880 (2004-04-01), Hunt et al.
Dilhaire et al., “Thermomechanical effects in metal lines on integrated circuits analysed with a differential polarmetric interferometer,” Microelectronics Reliability, (1998), vol. 38, p. 1591-1597.
Boles and Cengel, Thermodynamics: An engineerng approach, 2002, McGraw-Hill, 4thEd., p. 193-195.
Hamann Hendrik F.
Iyengar Madhusudan K.
Lacey James A.
Schmidt Roger R.
Fleit Gibbons Gutman Bongini & Bianco PL
Gibbons Jon A.
International Business Machines - Corporation
Pettitt John
Tyler Cheryl J
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