Apparatus for the treatment of semiconductors

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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118 49, 156643, 156646, 204164, 204192EC, 250531, 427 39, 427 95, B44C 122, C03C 1500, C03C 2506

Patent

active

041383060

ABSTRACT:
Apparatus for the treatment of semiconductors comprises a reaction chamber for effecting the vapor phase reaction of semiconductor substrates, means for introducing a vapor phase reaction gas into the reaction chamber, a plasma generating section, means for introducing into the plasma generating section a gas suitable for the plasma treatment of the inside of the reaction chamber, microwave power applying means for activating the gas contained in the plasma generating section, conduit means for introducing the activated gas into the reaction chamber, and evacuation means, whereby the undesired deposits formed on the parts other than the semiconductor substrates can be removed easily.

REFERENCES:
patent: 3924024 (1975-12-01), Naber et al.
patent: 4058638 (1977-11-01), Morton
patent: 4065369 (1977-12-01), Ogawa et al.

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