Apparatus for the treatment of semiconductor wafers by plasma re

Details Apparatus for the treatment of semiconductor wafers by plasma re Apparatus for the treatment of semiconductor wafers by plasma re

1980-11-20

1982-03-09

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156643, 156646, 204298, 42218304, 414225, C23F 102

Patent

active

043187676

ABSTRACT:
An apparatus for the treatment of semiconductor wafers by plasma reaction is disclosed. The apparatus comprises a first wafer carrying means for a wafer to be treated, a reaction chamber, a second wafer carrying means for a treated wafer, and a control means for driving respective elements thereof in linkage motion. The first wafer carrying means has a first arm type wafer carrying means, which comprises a pair of guide rails, a pair of sliders mounted on the guide rails, respectively, and a pair of first arms for carrying the wafer to be treated. The reaction chamber is provided with a pair of slits for taking the wafer into and out of the reaction chamber, a pair of open-close type vacuum sealing devices mounted on the slits, respectively. Similarly, the second wafer carrying means has a second arm type wafer carrying means. The first and second wafer carrying means are preferably placed in a preliminary vacuum chamber, whereby a high vacuum in the reaction chamber can readily be obtained to be suitable for use in an etching device for aluminum wiring, and the like.

REFERENCES:
patent: 4149923 (1979-04-01), Uehara et al.
patent: 4208159 (1980-06-01), Uehara et al.
patent: 4252595 (1981-02-01), Yamamoto et al.

Affiliated with

Also associated with

Rating

Apparatus for the treatment of semiconductor wafers by plasma re does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for the treatment of semiconductor wafers by plasma re, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for the treatment of semiconductor wafers by plasma re will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1839412