Apparatus for the treatment of a wafer by plasma reaction

Details Apparatus for the treatment of a wafer by plasma reaction Apparatus for the treatment of a wafer by plasma reaction

1978-06-16

1980-06-17

Sheridan, Robert G.

Material or article handling

Apparatus for charging a load holding or supporting element...

Load holding or supporting element including gripping means

118 50, 414287, 414404, 414406, 414744B, B65H 106

Patent

active

042081599

ABSTRACT:
An improved apparatus for the automatic handling of wafer materials is proposed for the plasma treatment of the wafers such as high-purity silicon semiconductor wafers. In this apparatus, the wafer carried by a carrier means to a position neighboring to a wafer table is picked up by a movable pick-up means and placed on the wafer table where it is subjected to the plasma treatment after the wafer table is fixed vacuum-tightly to a plasma reaction chamber. After completion of the treatment, the wafer is taken out by a second movable pick-up means and carried away by another carrier means to the succeeding processing step. Thus a possibility of full automatization of wafer processing is provided.

REFERENCES:
patent: 3874525 (1975-04-01), Hassan et al.
patent: 4047624 (1977-09-01), Dorrenbos

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