Metal fusion bonding – With means to handle work or product – Work portion comprises electrical component
Reexamination Certificate
2002-07-29
2004-11-23
Silverman, Stanley S. (Department: 1754)
Metal fusion bonding
With means to handle work or product
Work portion comprises electrical component
C228S006200, C228S044700
Reexamination Certificate
active
06820793
ABSTRACT:
FIELD OF THE INVENTION
The invention concerns an apparatus for the transport and equipping of substrates with semiconductor chips.
With the mounting of semiconductor chips, it is customary to connect the semiconductor chips, mainly power semiconductors, to the substrate by means of soft solder in order to guarantee an effective dissipation of the heat loss from the semiconductor chip occurring during operation via the solder connection.
As substrates, metal substrates, so-called leadframes, are mainly used where the semiconductor chips are soldered onto chip islands arranged one after the other or, optionally, next to each other. The leadframe is fed in cycles to a soldering station where the solder is applied and then to a bonding station where the semiconductor chip is placed onto the liquid solder by a Pick and Place system. The leadframe has holes arranged along its longitudinal edge into which pins engage during transport of the leadframe. A Die Bonder suitable for this process is marketed by the applicant under the designation 2007 SSI.
Single position substrates, so-called singulated substrates, are also used. Such a single position substrate comprises, for example, a ceramic chip which is covered on both sides with a metal layer. Mounting of the semiconductor chips takes place manually in that a preformed portion of solder, a so-called solder preform, is first placed on the single position substrate and then the semiconductor chip is placed onto the solder portion. Afterwards, the entire composite is hard-soldered in an oven. A semiautomatic assembly process is also known with which, instead of a preformed solder portion, solder in the form of paste is applied mechanically to the single position substrate. Afterwards, the single position substrates are manually equipped with the semiconductor chip and again hard-soldered in an oven.
The object of the invention is to develop an apparatus with which single position substrates can be equipped fully automatically.
BRIEF DESCRIPTION OF THE INVENTION
An apparatus in accordance with the invention for the transport and equipping of single position substrates with semiconductor chips has a channel with two side walls in which the single position substrates are transported in a transport direction. Feeding of the single position substrate takes place by means of toothed combs which can be raised and lowered and moved back and forth whereby each tooth moves one single position substrate forwards. Elements, resiliently-mounted in one of the side walls of the channel, have the effect that the single position substrates are pressed against the other side wall so that they are not swept away by the flow of inert gas prevailing in the channel.
The apparatus can also be set up for the transport of leadframes.
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Kellenberger Daniel
Suter Guido
Cooke Colleen P.
ESEC Trading SA
Ritchie David B.
Silverman Stanley S.
Thelen Reid & Priest LLP
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Ninoska
Thank you. I hope you realize that most of the time, I send you links like that one from the NYT in order to have you read it, ilitdsl it, and give me the real deal. This is so helpful!
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Supertae
You can wax scientific on me atmyine! Thanks for a thoughtful contribution on what is a potential risk we have to take seriously.On a flippant note, will a third group emerge in the autism community, one equivalent to tree-huggers who blame big plastics for wanting to make an entire generation of kids autistic? Will they target tupperware and bottled water companies for their heated diatribes? Will we all be labeled as plastic shills for wanting to see more research conducted?
Was this review helpful to you? Rating [ 3.20 ]
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