Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1991-02-25
1992-01-21
Nguyen, Nam X.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20429814, 20419212, C23C 1434
Patent
active
050825461
ABSTRACT:
An apparatus for reactively coating a substrate 1 with an electrically insulative material comprising an ac power supply connected to the cathodes 5, 5a which are disposed in an evacuable coating chamber 15, 15a. These cathodes interact electrically with the targets 3, 3a, and 3b, 3c to be to be sputtered. The apparatus has three electrodes 6, 5, 5a which are electrically separate from one another and from the sputtering chamber 26. Two electrodes are configured as magnetron cathodes 5, 5a wherein one of the cathode bases 11, 11a and the material of the targets 3, 3a, and 3b, 3c are electrically separate, and the third electrode functions as an anode 6 during the plasma discharge. For this purpose, a power supply source 10 for alternating current is connected to each of the two cathodes 5, 5a which, during a period of alternating current, function as a negative electrode and as a positive electrode. The power supply source 10 has a floating output with three terminals 12, 13, 14. The central tap 14 is connected to the negative pole of a DC power supply 21, the positive pole of which is electrically connected to anode 6. A low-induction, HF-suitable capacitor 16 is inserted between anode 6 and grounded vacuum chamber 26. Another low-induction, HF-suitable capacitor 17 and 18, respectively, is provided for each of the two cathodes between targets 3, 3a and 3b, 3c and their surroundings, and a fourth low-induction, HF-suitable capacitor 27 is between center tap 14 and anode 6, and a fifth capacitor 24 is inserted in the connecting line 23 between the two terminals 12, 13 and the connecting lines 8, 9 for the targets 3, 3a and 3b, 3c.
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Roegels Stephan
Szczyrbowski Joachim
Leybold Aktiengesellschaft
Nguyen Nam X.
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